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Application of Short Wave IR Camera in Semiconductor Detection

Application of Short Wave IR Camera in Semiconductor Detection

Semiconductors refer to materials with conductivity between conductors and insulators at room temperature. Semiconductors are widely used in consumer electronics, communication systems, medical equipment and other fields. Whether from the perspective of technology or economic development, semiconductors are of vital importance. Nowadays, most of the core units of electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide etc., and silicon is the most important one in commercial applications among various semiconductor materials.


Pure silicon ingots are transparent at room temperature, while doped silicon ingots are opaque at room temperature, and as the temperature rises, the opacity also increases; The sensitivity range of short wave IR cameras is 900-1700nm, and light above 1200nm can easily penetrate doped silicon ingots, which enables the use of short wave infrared in the quality inspection of semiconductor materials, the detection of defects or cracks in silicon ingots and wafers, and the precise laser alignment during wafer cutting.


Short wave IR camera haves excellent performance in semiconductor inspection. Use short wave IR cameras and microscope lenses as semiconductor inspection equipment to detect defects on silicon wafers under suitable light sources. The inspection results are as follows:


The front and back of the finished silicon wafer material are opaque, and visible light cannot pass through the silicon wafer material to observe the internal structure. Using a light source above 1200nm to illuminate the surface of the silicon wafer material, and with a suitable lens, the internal structure of the silicon wafer can be clearly observed. In the precise laser alignment step in the wafer cutting process, the use of short wave IR cameras can greatly improve the accuracy of wafer alignment, thereby increasing the yield of products.

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