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Custom Foundry Services

Custom Foundry Services

GHOPTO offers professional III-V device fabrication services through its Taiyuan Shanxi China laboratories. These facilities include 1300 square meters of clean rooms (class 100 to class 100,000) for wafer fabrication, chip packaging, and device testing with custom sensors and technology. GHOPTO's engineering can take your optoelectronics fabrication needs from process design, through development stages, and to commercial production in-house.  

Standard InGaAs Imagers


Standard InGaAs Imagers

Products lines of lattice matched Short-Wave-InfraRed (SWIR) Indium-Gallium-Arsenide (InGaAs) technology. This portfolio includes SWIR and VISIBLE-SWIR linear arrays, focal plane arrays, and cameras.



✔  Lattice Matched InGaAs image sensor and Camera Production

✔  15, 25, and 30 um Pitch

✔  Characterization

Custom IR Imagers


Custom IR Imagers

Custom ROIC and epitaxy integration, new imaging technologies such as APD, and T2SL FPAs.


✔  Characterization

✔  TAR* and ITAR*-free Production Advanced Technologies such as Lattice Mismatched InGaAs, APD, QWIP and T2SL







Foundry Services


Foundry Services

1300 square meters of clean rooms (class 100 to class 100,000) dedicated to wafer fabrication, chip packaging and device testing.


✔  Full Wafer Fabrication (up to 4 inch) and Production

✔  Device Processing and Chip Packaging

✔  Characterization


WAFER FABRICATION SERVICES (12 mm x 12 mm and larger pieces; 2”, 3”, and 4” wafers)

·OPTICAL CONTACT LITHOGRAPHY

·INDUCTIVELY COUPLED PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION (ICP-PECVD) of dielectrics

·E-BEAM and THERMAL EVAPORATION of a variety of metals

·SPUTTERING DEPOSITION of OXIDES AND METALS  

·RAPID THERMAL PROCESSING

·INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING (ICP-RIE) of III-V materials

·REACTIVE ION ETCHING of dielectric materials

·WET ETCHING

·LAPPING and POLISHING

·METROLOGY for in process controls

     ·WAFER PROBING

     ·FE-SEM

     ·SURFACE PROFILOMETER

     ·NANO-SPECTROMETER

     ·STRESS MEASUREMENT EQUIPMENT




STRESS MEASUREMENT EQUIPMENT

·CHIP CLEAVING

·FLIP-CHIP BONDING

·WIRE-BONDING



CHARACTERIZATION

·SEMICONDUCTOR ELECTRICAL PROPERTIES

·DEVICE IV MEASUREMENTS

·ELECTRO-SPECTRAL PROPERTIES of OPTOELECTRONIC DEVICES

     ·ROOM TEMPERATURE EPI-LAYER FTIR ABSORPTION MEASUREMENTS

·SPECTRAL RESPONSE, RESPONSIVITY, DETECTIVITY (D*), and NEDT 


Related SWIR Technology Cameras & Sensors
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